Memory chip manufacturer leaderboard
Three companies decide what DRAM costs. This table puts their bit share, HBM allocation, revenue trajectory, order coverage and capital spending side by side — sortable by any column, because the ranking changes completely depending on which number you care about. Combined tracked HBM capacity is roughly 422k wafer starts per month.
8 manufacturers · sortable · reported figures flagged in the export
| # | Manufacturer | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 | Samsung Semiconductor Hwaseong, KR · 1b nm, TC-NCF Back on top at 39% DRAM revenue share — levels last seen in 2024 — after ceding the lead in 2025. | 39.0% | 26% | $80.0B | +168.0% | 70.0% | 5.1Q | $88.0B | $33.6B | 140k |
| 2 | SK hynix Icheon, KR · 1b / 1c nm, TSV MR-MUF Record quarter, shrinking share: +214% YoY revenue but 39% → 26% as Samsung and Micron squeezed both ends. | 26.0% | 52% | $57.1B | +214.0% | 76.3% | 6.2Q | $96.5B | $24.1B | 175k |
| 3 | Micron Technology Boise, US · 1β / 1γ nm EUV One point behind SK hynix — the closest the two have been since 2014. Margin shown is GAAP net. | 25.0% | 19% | $41.5B | +345.8% | 68.1% | 5.8Q | $61.2B | $19.4B | 95k |
| 4 | CXMT Hefei, CN · G4 (17nm-class) Fastest-growing DRAM supplier globally; a fresh IPO to fund HBM and LPDDR6 capacity. | 5.0% | 0% | $6.6B | +716.0% | 9.4% | 2.9Q | $7.1B | $11.0B | 12k |
| 5 | Kioxia Tokyo, JP · BiCS 8 / 218L NAND-only. High-capacity QLC eSSD demand is the AI leverage point. | — | — | $4.6B | +39.8% | 26.1% | 3.4Q | $14.8B | $6.2B | — |
| 6 | SanDisk Milpitas, US · BiCS 8 / 218L (JV) Shares fab output with Kioxia; consumer channel exposure amplifies the retail SSD move. | — | — | $2.9B | +44.1% | 21.7% | 3.1Q | $8.9B | $3.1B | — |
| 7 | Nanya Technology New Taipei, TW · 20nm / 1A nm Second-fastest grower on ramped DDR4/LPDDR4/5 supply into a market with no slack. | 2.0% | — | $2.6B | +690.0% | 31.0% | 3.2Q | $4.4B | $1.9B | — |
| 8 | Winbond Taichung, TW · 25nm / 20nm Specialty and niche DRAM; benefits when tier-1s abandon low-density parts. | 0.9% | — | $0.3B | +51.2% | 15.3% | 3.8Q | $1.2B | $0.6B | — |
How to read these columns
- DRAM bit share
- Share of industry DRAM bits shipped, not revenue. Bits are the honest unit — revenue share flatters whoever sells the most HBM.
- HBM share
- Share of high-bandwidth memory stacks shipped. This is the only column that maps directly to AI accelerator supply.
- Backlog
- Quarters of booked demand at current shipment rates. Anything above four quarters means the buyer, not the seller, is negotiating from weakness.
- Booked value
- Estimated dollar value of committed orders, increasingly locked in with hyperscaler prepayments.
- Capex FY
- Fiscal-year front-end capital spending. Note the lag: tool-in to volume bits runs seven to nine quarters.
- HBM wpm
- HBM wafer starts per month, in thousands. The single hardest constraint in the AI supply chain.